Equivalent Specifications

BS EN 13601:2002 CW009A
BS EN 13604:2002 CW009A
UNS 10100
Cu OFE
ASTM B 170 C10100
ASTM B 224 C10100
DIN 17673
DIN 17672
BS 2874 C103
NF A53 301
SIS 14 50 11

Key Features

An electronic oxygen free grade of high purity copper.

Typical Uses

This is an oxygen free electronic Grade 1 which is produced with an oxygen content less than 0.0005%.

It can be manufactured with a grain size less than 0.2mm dia. Applications include components for vaccum systems glass to metal seals in electronic equipment. Thermostatic control valves, rotor conductors for large generators.

Any applications which require high conductivity – either heat transfer or electrical.

Description Copper Cu
Nominal Composition Cu OFE
Alloy Type wrought

Typical Mechanical Properties

Tensile Strength (N/mm²) 226
Proof/Yield Strength (N/mm²) 212
Elongation (%) 28
Hardness Brinell 76
Impact Izod J20°C

Typical Physical Properties

Density g/cm³ 8.94
Melting Temperature Range °C 1083 - 1083
Thermal Conductivity W/mK 393
Electrical Resistivity μΩ.m15°C 1.7
Coefficient of Thermal Expansion 0-250°C 17.2
Relative Magnetic Permeability 1.01
Coefficient of Friction 0.53

Copper Alloys has the ability to modify existing alloys for improved performance. Many customers have benefited from this in the past.

To discuss your requirements, call a member of Copper Alloys’s technical team on +44 (0) 1782-816888, or email [email protected].

Contact

+44 (0) 1782 816888

[email protected]

Auckland Street, Stoke-on-Trent, ST6 2AZ, United Kingdom